Tiwei Wei, Ph.D.

Tiwei Wei, Ph.D., is an Assistant Professor in the Department of Mechanical and Aerospace Engineering at the University of California, Los Angeles. His research focuses on thermal science, particularly in semiconductor packaging and integration, including heat transfer in advanced interconnects, electronic cooling, and materials for thermal management. He leads the Thermal Science Laboratory for Semiconductor Packaging & Integration and is involved in projects related to microfluidic cooling, MEMS fabrication, and reliability modeling. Dr. Wei's work has been recognized with several awards, including the ASME Electronic and Photonic Packaging Division Early Career Engineer Award and the Intel Rising Star Faculty Award. His research is supported by grants from the Department of Energy and other organizations.

Tiwei Wei is an Assistant Professor at the University of California, Los Angeles (UCLA), specializing in Heat Transfer, Thermal Sciences, and Thermal Stress. His research focuses on semiconductor packaging, heterogeneous integration, and advanced cooling solutions for high-power electronics. Wei's work includes experimental and numerical studies of liquid jet impingement cooling, 3D printed microchannel coolers, and direct-on-chip cooling systems. His research addresses challenges in thermal management for 2.5D and 3D integrated systems, with an emphasis on improving energy efficiency and reliability. Wei's publications explore microfluidic cooling, nozzle scaling effects, and conjugate heat transfer modeling for high-performance electronics.