Regular biography
Pang Hock Lye, John is a Professor and Deputy Director (Curriculum) of the AMTA Programme Office at Nanyang Technological University, Department of Mechanical Engineering. His contact details include an email address of MHLPANG@ntu.edu.sg and an office location at N3-02b-55/N3.2-02-04. His professional profile can be accessed via the university's website at https://dr.ntu.edu.sg/cris/rp/rp00686. Research interests and other details are not provided in the available information.
Scholar-generated biography
John H L Pang is a researcher specializing in mechanics, reliability, joining-solder/welding, and metal additive manufacturing. His work focuses on the mechanical behavior of solder joints under various conditions, including thermal cycling, fatigue, and drop impact testing. He has investigated the effects of temperature, strain rate, and microstructure on the properties of solder alloys, such as Sn–Ag–Cu. Additionally, he has explored the reliability of electronic packages and the characterization of intermetallic compounds (IMC) in solder joints. His research also includes finite element modeling and digital image correlation techniques for analyzing material deformation and failure mechanisms.