Regular biography
Joungho Kim is a Faculty member in the School of Electrical Engineering at KAIST. His research focuses on areas related to HBM, TSV, and interconnection technologies. He leads the Terabyte Interconnection and Package Laboratory, where his team explores advanced computing solutions for artificial intelligence. His work has been recognized through several awards, including the 7th Hanyang Paiknam Prize in Engineering. Kim's research group also contributes to academic conferences, with students receiving awards such as the IEEE EDAPS 2025 Best Student Award and the DesignCon 2025 Best Paper Award.
Scholar-generated biography
Joungho Kim is a Professor of Electrical Engineering at KAIST, specializing in 3D IC Signal Integrity, EMC, and WPT. His research focuses on the design and analysis of wireless power transfer systems, with an emphasis on coil design, shielding methods, and magnetic field optimization. He also investigates through silicon via (TSV) technology, including its electrical modeling, noise coupling, and integration in 3D ICs. His work addresses challenges in power distribution networks, electromagnetic interference reduction, and the development of 3D SiP systems. Kim's research contributes to the advancement of high-efficiency, low-emission wireless power transfer and 3D integrated circuit design.