Jimin Kwon

Jimin Kwon is a Faculty member in the School of Electrical Engineering at KAIST. His research focuses on device-to-system integration for AI hardware, including monolithic and heterogeneous 3D IC technologies, advanced semiconductor packaging, and multi-chip system design. His work integrates electrical engineering with mechanical, materials, and chemical engineering to develop integrated semiconductor technologies for next-generation AI systems. Kwon's research includes 3D IC design methodologies, packaging technologies, and system-level evaluation. He is also interested in Agentic AI research systems for data integration and collaboration between AI and human researchers.

Jimin Kwon is a researcher at KAIST with expertise in heterogeneous integration, monolithic 3D integration, advanced packaging, DTCO, and STCO. His work focuses on developing innovative electronic systems through the integration of flexible and stretchable materials. Kwon's research includes the fabrication of 3D printed organic transistors and integrated circuits with high yield and stability, as well as the development of multimodal sensors for pressure and temperature sensing. His publications explore the use of inkjet printing for large-scale circuit fabrication and the creation of flexible, wearable electronic devices. His research also addresses the challenges of dielectric materials and gate structures in organic field-effect transistors.